Wiring board with electronic components

TW202634880APending Publication Date: 2026-08-16DAI NIPPON PRINTING CO LTD

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Patent Information

Application Number: TW114136305
Authority / Receiving Office: TW · TW
Patent Type: Applications
Current Assignee / Owner
Priority Date: 2024-10-31
Filing Date: 2025-09-22
Publication Date: 2026-08-16

Application Information

Patent Timeline

31 Oct 2024

Priority

22 Sep 2025

Application

TW114136305

16 Aug 2026

Publication

TW202634880A

IPC: H05K3/28; H05K1/18

Inventors: 亀川人; 渡部壮周

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Abstract

The wiring board (20) with electronic components includes an insulating substrate (31), a metal wiring portion (32) formed on the insulating substrate (31), an electronic component (21) mounted on the metal wiring portion (32), and a cover layer (35) covering the electronic component (21) and the metal wiring portion (32). The wiring board (20) with electronic components does not contain solder resist.

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