Reinforced Backplate Structure of Computer Case

TW202634883APending Publication Date: 2026-08-16HYTE CORP
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Patent Information

Application Number
TW114105331
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-13
Publication Date
2026-08-16
Estimated Expiration
2045-02-12

AI Technical Summary

Technical Problem

Traditional computer case backplates use mixed thickness steel plates, compromising the durability of the motherboard and back panel, and sheet-like ventilation structures lack sufficient structural support, leading to deformation and damage.

Method used

A reinforced backplate structure with angled reinforcing sections on guide plates and buffer spaces to enhance structural strength, combined with angled connecting plates and expansion guides for improved support and ventilation.

Benefits of technology

Prevents deformation and damage to ventilation holes while maintaining consistent airflow and structural integrity, enhancing the backplate's durability and aesthetics.

✦ Generated by Eureka AI based on patent content.

Smart Images

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Patent Text Reader

Abstract

This invention relates to a backplate reinforcement structure for a computer chassis. It comprises a backplate body applied to a pre-designed chassis of a pre-designed computer host. The backplate body has a heat dissipation section and an I / O assembly section for exposing a pre-designed I / O panel. The heat dissipation section has a ventilation hole, and a plurality of guide plates connecting two sides are located at the ventilation hole. Each guide plate has a reinforcing section on both sides to enhance structural strength. Each reinforcing section has a first connecting plate that connects to an adjacent side of the backplate body after being rotated at an angle. A first buffer space is formed inside the first connecting plate. The reinforcing sections on both sides of each guide plate provide stronger support, and the first buffer space reduces external forces, resulting in a thinner and lighter backplate design. This design saves costs while avoiding damage or deformation due to insufficient structural strength of the guide plates. Furthermore, the design of the sheet-like guide plates ensures the overall consistency of the ventilation holes.
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Description

[Technical Field]

[0001] This invention relates to a backplate reinforcement structure for a computer case, particularly a heat dissipation section with a large ventilation structure on the backplate body, which allows multiple air guides on the heat dissipation section to guide the airflow and strengthen the structure of each air guide by the reinforcement on both sides, so as to achieve the effect of designing a thin and light backplate, saving costs while avoiding damage or deformation due to insufficient structural strength of each air guide, and the design of the sheet-like air guide can keep the ventilation holes consistent as a whole. [Previous Technology]

[0002] Note: With the advancement of technology, computer equipment has become one of the essential devices for most families, companies, and shopping malls. As computer hosts develop, they are gradually being replaced. Their performance is also improving along with the gradual upgrading of related equipment, enabling them to play a better role. Among these factors, the heat dissipation and ventilation effect of the computer host case is also one of the considerations when choosing a computer host configuration.

[0003] In traditional practice, 5-6kg casings mostly use 0.5mm steel plates, while 7-8kg casings use 0.6mm steel plates, and so on. This is a practice of mixing steel plates to save costs in response to rising raw material prices. Therefore, it is very common for a casing to have mixed steel plates of different thicknesses of 0.6mm, 0.7mm, and 0.8mm.

[0004] Most manufacturers use thicker 0.8mm steel plates for the side panels, which can improve the sturdy feel when consumers remove the side panels. However, the motherboard, back panel and other parts of the case that actually bear the weight are made of thinner 0.5mm or 0.6mm steel plates. This reduces the durability of the motherboard and back panel and increases the risk to the lifespan of the case itself.

[0005] In the past, most computer main units used round or diamond-shaped ventilation holes on the back panel for heat dissipation, taking into account structural strength. Although they have strong structural strength, they limit the ventilation space and the development of appearance. For this reason, some manufacturers use sheet-like ventilation structures to increase the size of the ventilation space. However, the support strength of simple sheet-like structures is insufficient, and they are easily deformed or broken due to external impact. This is the key point that those engaged in this industry urgently need to study and improve. [Summary of the Invention]

[0006] Therefore, in view of the above-mentioned problems and deficiencies, the inventor collected relevant information, conducted multiple evaluations and considerations, and, based on years of experience accumulated in this industry, through continuous brainstorming, finally designed this invention patent with a backplate reinforcement structure for computer cases.

[0007] The main objective of this invention is to provide a backplate reinforcement structure for a computer chassis. The backplate body is provided with a heat dissipation section and an I / O assembly section for exposing a preset I / O panel. The heat dissipation section has a ventilation hole and a plurality of guide plates connecting the two sides at the ventilation hole. Each guide plate has a reinforcement section on both sides that enhances the structural strength. The reinforcement section has a first connecting plate that connects to the side of the adjacent backplate body after being rotated at an angle. A first buffer space is formed inside the first connecting plate. The reinforcement sections on both sides of each guide plate provide stronger support and utilize the first buffer space to reduce external forces, thereby preventing damage or deformation of the guide plates due to insufficient structural strength.

[0008] A secondary objective of the present invention is that the reinforcing part of each of the guide plates is rotated 90 degrees.

[0009] Another object of the present invention is that the I / O assembly part is provided with an I / O connection groove for exposing the preset I / O panel, and the I / O connection groove is provided with a narrower first connection groove and a wider second connection groove, and the inner side of the I / O assembly part is further assembled with an extension seat surrounding the periphery of the I / O connection groove, and the extension seat is provided with a first expansion part corresponding to the first connection groove and a second expansion part corresponding to the second connection groove.

[0010] Another object of the present invention is that the back panel body is further provided with a power assembly part, the power assembly part having a power connection port, and a support part extending horizontally inward from the bottom side of the power assembly part to provide support for a preset power supply of the preset computer host.

[0011] Another object of the present invention is that the first expansion part and the second expansion part are provided with a first expansion connection slot and a second expansion connection slot for exposing the preset I / O panel inside the preset computer host, and at least one side of the expansion base is provided with a first assembly part, and the expansion base is further provided with a plurality of expansion guides, and at least one expansion guide plate connecting the two sides is provided at the guide hole formed in each of the expansion guides, and each of the at least one expansion guide plate is provided with a reinforcing part on both sides to enhance the structural strength, and the reinforcing part is connected to at least one second connecting plate adjacent to the side of the expansion guide after being rotated by an angle, and a second buffer space is formed inside the at least one second connecting plate, and at least one side of each expansion guide is provided with a second assembly part corresponding to the first assembly part.

[0012] Another object of the present invention is that the periphery of the I / O assembly part of the back plate body is provided with a plurality of first screw grooves, and the periphery of the expansion base is provided with at least one first assembly plate corresponding to each of the first screw grooves, and the at least one first assembly plate is provided with a second screw groove corresponding to each of the first screw grooves so that a preset fastener can lock and fix it in place.

[0013] Another object of the present invention is that the first assembly part on the expansion base is provided with a plurality of vertically arranged first assembly holes, and a limiting groove is recessed on the bottom side of each of the first assembly holes. The second assembly part on each of the expansion guides is provided with a second assembly hole corresponding to each of the first assembly holes in the first assembly part for a preset fastener to lock and fix in place. A limiting protrusion corresponding to the limiting groove extending into the first assembly part is provided on the inner side of the second assembly part to form a limiting protrusion for supporting and limiting. A third assembly groove is provided on the side of each expansion guide where the second assembly part is not provided.

[0014] Another object of the present invention is that at least one or more fan assemblies are further provided inside the preset computer host on the inner side of the back panel body, which are aligned with the heat dissipation part.

[0015] Another object of the present invention is that when there is one or more fan assemblies, they can be arranged horizontally or vertically.

[0016] Another object of the present invention is that the thickness of each of the guide plates, each of the reinforcing portions, the at least one expanded guide plate of the expanded guide member and each of the reinforcing portions of the back plate body is between 0.5 mm and 0.6 mm.

Implementation Method

[0018] Please refer to Figures 1 to 6, which are perspective views, another perspective view, exploded perspective view, another perspective exploded perspective view, a partial enlarged view of part A in Figure 1, and a partial enlarged view of part B in Figure 4. The back panel reinforcement structure of the computer chassis of the present invention mainly includes a back panel body 1 applied to a preset chassis (not shown) of a preset computer host (not shown in the figure). The connection relationship of the aforementioned components is as follows:

[0019] The back panel body 1 is provided with a heat dissipation part 11, an I / O assembly part 12 and a power assembly part 13. The heat dissipation part 11 has a ventilation hole 110, and the heat dissipation part 11 has a plurality of guide plates 111 connecting the two sides at the ventilation hole 110. Each guide plate 111 has a reinforcing part 112 on both sides to enhance the structural strength. The reinforcing part 112 is a first connecting plate 1121 that is connected to the side adjacent to the back panel body 1 after being rotated by an angle, and a first buffer space 1120 is formed inside the first connecting plate 1121.

[0020] Furthermore, the rotation angle of the aforementioned reinforcing part 112 is 90 degrees, which can maximize the air volume without affecting the strength of the structure. This angle is not limited to 90 degrees. Such simple and uniform changes and modifications do not limit the scope of protection of this invention, as stated herein.

[0021] The aforementioned I / O assembly part 12 is provided with an I / O connection groove 120 for exposing the preset I / O panel (not shown in the figure) inside the preset computer host, and a plurality of first screw grooves 121 are provided at the periphery of the I / O assembly part 12, and the I / O connection groove 120 is provided with a narrower first connection groove 1201 and a wider second connection groove 1202.

[0022] The power assembly 13 has a power connection port 130, and a support part 131 extends horizontally inward from the bottom side of the power assembly 13 to provide support for a preset power supply (not shown in the figure) of the preset computer host.

[0023] Furthermore, the preset computer host located inside the back panel body 1 is further provided with at least one or more fan assemblies 14 aligned with the heat dissipation part 11, and when there is one or more fan assemblies 14, they can be arranged horizontally or vertically. Such simple and uniform changes and modifications do not limit the scope of protection of the present invention, and are hereby stated.

[0024] The inner side of the aforementioned I / O assembly part 12 is further assembled with an extension seat 2 surrounding the periphery of the I / O connection groove 120. The extension seat 2 is provided with a first expansion part 21 corresponding to the first connection groove 1201 and a second expansion part 22 corresponding to the second connection groove 1202. At least one first assembly plate 23 corresponding to each of the first screw grooves 121 is provided at the periphery of the extension seat 2. The at least one first assembly plate 23 is provided with a second screw groove 23 respectively aligned with each of the first screw grooves 121. The slot 230, the aforementioned first expansion portion 21 and the second expansion portion 22 are provided with a first expansion connection slot 210 and a second expansion connection slot 220 for exposing the preset I / O panel inside the preset computer host, and at least one side of the expansion base 2 is provided with a first assembly portion 24, and the first assembly portion 24 is provided with a plurality of vertically arranged first assembly holes 240, and a limiting groove 241 is recessed on the bottom side of each first assembly hole 240. The expansion base 2 is further provided with a plurality of expansion guides 25, and Each of the expanded flow guides 25 has a flow guide hole 250 with at least one expanded flow guide plate 251 connecting both sides. Each of the at least one expanded flow guide plate 251 has a reinforcing part 252 on both sides to enhance structural strength. Each reinforcing part 252 is connected to at least one second connecting plate 2521 adjacent to the side of the expanded flow guide 25 after being rotated at an angle. A second buffer space 2520 is formed inside the at least one second connecting plate 2521. At least one side of each of the expanded flow guides 25... The first assembly part 253 is provided to correspond to the first assembly part 24. The second assembly part 253 is provided with second assembly holes 2530 that are aligned with the first assembly holes 240 in the first assembly part 24. A limiting protrusion 2531 is provided on the inner side of the second assembly part 253 to support and limit the corresponding limiting groove 241 that extends into the first assembly part 24. A third assembly groove 254 for assembling the preset I / O panel is provided on the side of each expansion guide 25 that does not have the second assembly part 253.

[0025] Furthermore, each of the aforementioned first screw grooves 121, second screw grooves 230, first assembly holes 240, and second assembly holes 2530 is provided with a preset locking fastener (not shown in the figure) for locking and fixing.

[0026] In practical application, the backplate body 1 is disposed at the rear of the preset computer host, so that the power connection port 130 on the power assembly 13 is aligned with a preset power interface (not shown) of the preset power supply inside the preset computer host. The support portion 131 provided on the bottom side of the power assembly 13 abuts against the bottom of the preset power supply and can be further locked in place by a plurality of fasteners (not shown). At the same time, the preset I / O panel on the preset motherboard (not shown) inside the preset computer host can be aligned and assembled at the I / O assembly 12. The default fan inside the computer host (not shown in the figure) corresponds to the heat dissipation unit 11. The default fan performs air intake and exhaust through the ventilation holes 110 of the heat dissipation unit 11. The guide plates 111 located at the ventilation holes 110 not only guide the air intake and exhaust but also prevent large external dirt and dust from entering the default computer host. The reinforcing parts 112 located on both sides of each guide plate 111 enhance the structural strength of the guide plate 111 to prevent the guide plate 111 from easily deforming or being damaged. This achieves the effect of expanding the ventilation of the back panel body 1 and preventing the guide plates 111 from being damaged or deformed.

[0027] The reinforcing portions 112 on both sides of each of the aforementioned guide plates 111 are connected to the back plate body 1 via the first connecting plate 1121. The first connecting plate 1121 is rotated at an angle to connect the two sides of each horizontal guide plate 111 to the adjacent back plate body 1. A first buffer space 1120 is formed in the first connecting plate 1121 to disperse external forces. This space can provide buffering and strengthen the support on both sides when the guide plates 111 are accidentally touched or pulled, so as to avoid damage or deformation of the guide plates 111.

[0028] Furthermore, considering conventional computer cases, in order to save on case production costs, the side panels of various cases are often quite thick. However, the back panel and motherboard components that actually provide support are relatively thin. Therefore, the ventilation holes and heat dissipation holes provided on the back panel and motherboard are more prone to deformation and damage. In order to improve the strength of the ventilation holes and heat dissipation holes, the thickness of each of the guide plates 111, each of the reinforcing parts 112, the at least one extended guide plate 251 provided on the extended guide member 25 and each of the reinforcing parts 252 of the back panel body 1 of the present invention is between 0.5mm and 0.6mm, which is consistent with the thickness of the back panel body 1. This allows the back panel body 1 to save costs without easily deforming or being damaged.

[0029] Under the premise of considering the structural strength mentioned above, most of them use round or diamond-shaped ventilation holes for heat dissipation. However, this is slightly lacking in aesthetics and consistency. Considering that most computer I / O designs are close to square, using plate-shaped ventilation holes can not only match the aesthetics of the host but also maintain the overall consistency.

[0030] Furthermore, the inner side of the aforementioned I / O assembly section 12 is further assembled with the expansion base 2 surrounding the periphery of the I / O connection groove 120. The expansion base 2 allows for the assembly of the expansion guides 25 at the I / O connection groove 120, enabling the placement of the expansion guides 25 to be changed according to the preset I / O panel assembly position. The second assembly section 253, located on at least one side of each expansion guide 25, is correspondingly assembled onto the first assembly section 24 on at least one side of the expansion base 2. This is achieved by attaching at least one expansion guide plate 251 to the expansion guide 25. The reinforcing parts 252 on both sides are connected to the expansion base 2 via the second connecting plate 2521. The second connecting plate 2521 is rotated at an angle to connect the two sides of the horizontal expansion guide plate 251 to the adjacent expansion base 2. A second buffer space 2520 is formed in the second connecting plate 2521 to disperse external forces. This provides cushioning and strengthens the support on both sides when the expansion guide plate 251 is accidentally touched or pulled, so as to avoid damage or deformation of the expansion guide plate 251.

[0031] The main purpose of this invention is to address the heat dissipation section 11 with a large ventilation structure on the back panel body 1 installed on the rear side of the preset computer host, so that each of the air guide plates 111 on the heat dissipation section 11 can guide the airflow direction and rely on the reinforcing parts 112 on both sides to strengthen the structure of each air guide plate 111, so as to avoid damage or deformation of each air guide plate 111. The expansion bracket 2 assembled inside the I / O assembly section 12 provides free expansion of the preset I / O panel position. Assuming that the secondary purpose of installing the extended airflow guide 25 is to guide the airflow direction, and further, for the main unit with a relatively thin back panel, the airflow guide 111, the reinforcing part 112, the at least one extended airflow guide 251 and the reinforcing part 252 of the back panel body 1 of the present invention are designed to enhance structural strength and prevent deformation and damage. The thickness of the at least one extended airflow guide 251 and the reinforcing part 252 is between 0.5 mm and 0.6 mm.

[0032] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, any simple modifications and equivalent structural changes made based on the contents of the present invention specification and drawings should also be included within the patent scope of the present invention and are hereby stated.

[0033] In summary, the backplate reinforcement structure of the computer chassis of the present invention can effectively achieve its function and purpose in practical applications. Therefore, the present invention is indeed a highly practical research and development. In order to meet the application requirements for an invention patent, this application is hereby filed in accordance with the law. We hope that the Examination Board will grant this application as soon as possible to protect the inventor's hard work in research and development. If the Examination Board has any questions, please do not hesitate to write to us for guidance. The inventor will do his best to cooperate. We would be very grateful for your help. [Simplified Explanation of the Diagram]

[0017] [Figure 1] is a perspective view of the backplate reinforcement structure of the computer case of the present invention. [Figure 2] is another perspective view of the backplate reinforcement structure of the computer case of the present invention. [Figure 3] is an exploded perspective view of the backplate reinforcement structure of the computer case of the present invention. [Figure 4] is another exploded perspective view of the backplate reinforcement structure of the computer case of the present invention. [Figure 5] is a partial enlarged view of part A in Figure 1 of the present invention. [Figure 6] is a partial enlarged view of part B in Figure 4 of the present invention.

Claims

1. A backplate reinforcement structure for a computer chassis, comprising a backplate body applied to a pre-set chassis of a pre-set computer host, wherein the backplate body is provided with a heat dissipation part and an I / O assembly part for exposing a pre-set I / O panel, the heat dissipation part having a ventilation hole, and a plurality of guide plates connecting two sides of the heat dissipation part at the ventilation hole, wherein each guide plate has a reinforcing part on both sides for strengthening the structure, the reinforcing part having a first connecting plate on one side of an adjacent backplate body after being rotated at an angle, and a first buffer space is formed inside the first connecting plate, wherein the reinforcing parts on both sides of each guide plate provide stronger support and utilize the first buffer space to reduce external forces.

2. The backplate reinforcement structure of the computer chassis as described in claim 1, wherein the reinforcement of each of the airflow guides is rotated 90 degrees.

3. The back panel reinforcement structure of the computer chassis as described in claim 1, wherein the I / O assembly part is provided with an I / O connection slot for exposing the preset I / O panel, and the I / O connection slot is provided with a narrower first connection slot and a wider second connection slot, and an extension seat is further assembled on the inner side of the I / O assembly part around the periphery of the I / O connection slot, and the extension seat is provided with a first expansion part corresponding to the first connection slot and a second expansion part corresponding to the second connection slot.

4. The back panel reinforcement structure of the computer case as described in claim 1, wherein the back panel body is further provided with a power supply assembly part, and the power supply assembly part has a power connection port, and a support part extends horizontally inward from the bottom side of the power supply assembly part to provide support for a preset power supply of the preset computer host.

5. The back panel reinforcement structure of the computer chassis as described in claim 3, wherein the first expansion section and the second expansion section are provided with a first expansion connection slot and a second expansion connection slot for exposing the preset I / O panel inside the preset computer host, and at least one side of the expansion base is provided with a first assembly section, and the expansion base is further provided with a plurality of expansion guides, and at least one expansion guide plate connecting the two sides is provided at the guide hole formed in each expansion guide, and each of the at least one expansion guide plate is provided with a reinforcing section on both sides to enhance the structural strength, and the reinforcing section is connected to at least one second connecting plate adjacent to the side of the expansion guide after being rotated at an angle, and a second buffer space is formed inside the at least one second connecting plate, and at least one side of each expansion guide is provided with a second assembly section corresponding to the first assembly section.

6. The backplate reinforcement structure of the computer chassis as described in claim 5, wherein the thickness of each of the air guides, each of the reinforcements, the at least one expansion air guide of the expansion air guide and each of the reinforcements of the backplate body is between 0.5 mm and 0.6 mm.

7. The backplate reinforcement structure of the computer case as described in claim 3, wherein the periphery of the I / O assembly part of the backplate body is provided with a plurality of first screw grooves, and the periphery of the expansion base is provided with at least one first assembly plate corresponding to each of the first screw grooves, and the at least one first assembly plate is provided with a second screw groove corresponding to each of the first screw grooves for a preset fastener to lock in a fixed position.

8. The back panel reinforcement structure of the computer case as described in claim 5, wherein the first assembly part on the expansion base is provided with a plurality of vertically arranged first assembly holes, and a limiting groove is recessed on the bottom side of each of the first assembly holes; the second assembly part on each of the expansion guides is provided with a second assembly hole corresponding to each of the first assembly holes in the first assembly part for a preset fastener to lock in position; a limiting protrusion corresponding to the limiting groove of the first assembly part is provided on the inner side of the second assembly part to form a limiting protrusion for abutting and limiting; and a third assembly groove is provided on the side of each expansion guide where the second assembly part is not provided.

9. The back panel reinforcement structure of the computer chassis as described in claim 1, wherein the preset computer host inside the back panel body is further provided with at least one or more fan assemblies aligned with the heat dissipation part.

10. The backplate reinforcement structure of the computer chassis as described in claim 9, wherein when there is one or more fan assemblies, they can be arranged horizontally or vertically.