Circuit board and electrical device

Abstract

The present invention provides a circuit board and an electrical device. The circuit board has a board body, a first chip module, a second chip module. The board body has a plurality of fastening holes, a first common fastening hole, and a second common fastening hole. The first chip module is disposed on the board body. The second chip module is disposed on the board body. A gap is formed between the first chip module and the second chip module. A plurality of fastening elastic pieces are disposed on both sides of the first chip module and the second chip modules. Two of the fastening elastic pieces are jointly fastened on the first common locking hole, and the other two locking elastic pieces are jointly fastened on the second common locking hole. The first common locking hole is disposed on a side of the gap, and between two of the locking holes. The second common locking hole is disposed on another side of the gap, and between another two of the locking holes.

Description

[Technical Field]

[0001] This invention relates to a circuit board, and more particularly to a circuit board having a plurality of chip modules and a heat pipe heat dissipation module, as well as an electronic device having the circuit board. [Previous Technology]

[0002] To enhance a computer's image processing capabilities, circuit boards typically house a separate graphics processing unit (GPU) module in addition to the central processing unit (CPU) module. Furthermore, the GPU is equipped with multiple memory modules. Therefore, the space available on the circuit board for mounting heat pipe cooling modules is becoming increasingly limited. In particular, the mounting holes for the heat pipe cooling modules need to penetrate the entire circuit board.

[0003] In addition, the position of the mounting holes needs to be considered for the symmetry of their arrangement to avoid uneven pressure applied to the chip module. Furthermore, the placement of the heat pipe cooling module also affects the bending curvature of the heat pipes. The solutions to the above problems are even more stringent due to the miniaturization of the circuit board area.

[0004] Therefore, how to improve the space utilization of the circuit board through structural design improvements to overcome the above-mentioned defects has become one of the important issues to be addressed in this technical field. [Summary of the Invention]

[0005] The technical problem to be solved by the present invention is to provide a circuit board that reduces the space occupied by the mounting holes of the circuit board and improves the space utilization of the circuit board.

[0006] To solve the above-mentioned technical problems, one of the technical solutions adopted by the present invention is to provide a circuit board, which includes a board body having a plurality of locking holes, a first common locking hole, and a second common locking hole; a first chip module disposed on the board body; a second chip module disposed on the board body, wherein a gap is provided between the second chip module and the first chip module; and a plurality of locking springs disposed on both sides of the first chip module and the second chip module, wherein two locking springs are jointly locked to the first common locking hole, and the other two locking springs are jointly locked to the second common locking hole; wherein the first common locking hole is located on one side of the gap and between two of the locking holes, and the second common locking hole is located on the other side of the gap and between the other two locking holes.

[0007] In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an electronic device, which includes the above-mentioned circuit board; a plurality of display memory chips disposed on the circuit board and located around the first chip module; a heat pipe abutting against the first chip module and the second chip module; and at least one cooling fan connected to the heat pipe.

[0008] One of the beneficial effects of the present invention is that the circuit board provided by the present invention can reduce the total number of locking holes by using the technical solution of the first shared locking hole and the second shared locking hole, thereby increasing the space utilization of the circuit board, which is beneficial to the placement of electronic components and the routing of circuits, as well as increasing the stability of the structure.

[0009] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are for reference and illustration only and are not intended to limit the present invention.

Implementation Method

[0010] [First Embodiment]

[0011] Please refer to Figures 1 and 2. An embodiment of the present invention provides a circuit board 100 and an electronic device having the circuit board 100. For example, the electronic device may be a notebook computer, other types of computers, or any device that requires such a circuit board.

[0012] The circuit board 100 includes a board body 10, a first chip module C1, and a second chip module C2. The first chip module C1 and the second chip module C2 are disposed on the board body 10. A gap 102 is provided between the second chip module C2 and the first chip module C1.

[0013] For example, the first chip module C1 may be a graphics processing unit (GPU), and the second chip module C2 may be a central processing unit (CPU). In some embodiments, multiple display memories G1, G2, G3, and G4 may be disposed around the first chip module C1 to store graphics data processed or about to be read by the first chip module C1. In addition, due to circuit routing planning or other design considerations, the circuit board 100 also has a restriction area R1, which refers to an area that is restricted from forming a keyhole.

[0014] To dissipate the residual heat generated during the operation of the first chip module C1 and the second chip module C2, a heat pipe cooling module is also provided on the circuit board 100, which includes a heat pipe P and two cooling fans F1 and F2. The number of cooling fans can be at least one. The heat pipe P is connected to the first chip module C1 and the second chip module C2. The two cooling fans F1 and F2 are respectively connected to both ends of the heat pipe P.

[0015] The plate 10 may be provided with multiple locking holes, which are used to cooperate with locking springs to fix the heat pipe P. In this embodiment of the invention, the number of locking holes is four, but it is not limited to this. As the space for locking holes in the plate 10 is becoming increasingly limited, this embodiment also includes shared locking holes, including a first shared locking hole 13 and a second shared locking hole 14, to reduce the total number of locking holes. The first shared locking hole 13 is located between two of the locking holes, and the second shared locking hole 14 is located between the other two locking holes. A feature of this embodiment is that multiple locking springs (21a, 21b, 22a, 22b) are disposed on both sides of the first wafer module C1 and the second wafer module C2, two locking springs (21a, 22a) are jointly locked to the first shared locking hole 13, and the other two locking springs (21b, 22b) are jointly locked to the second shared locking hole 14.

[0016] Specifically, the board body 10 has a first locking hole 11, a second locking hole 12, a first common locking hole 13, a second common locking hole 14, a third locking hole 15, and a fourth locking hole 16. The first locking hole 11 and the second locking hole 12 are located on the outside of the first chip module C1, that is, on the side away from the second chip module C2. The third locking hole 15 and the fourth locking hole 16 are located on the outside of the second chip module C2, that is, on the side away from the first chip module C1.

[0017] The first common locking hole 13 is located on one side of the gap 102 and between the first locking hole 11 and the third locking hole 15. The first locking hole 11, the first common locking hole 13, and the third locking hole 15 are arranged in a roughly straight line.

[0018] The second common locking hole 14 is located on the other side of the slit 102 and between the second locking hole 12 and the fourth locking hole 16. The second locking hole 12, the second common locking hole 14, and the third locking hole 15 are arranged in a roughly straight line in sequence.

[0019] Referring to Figure 2, the circuit board 100 of this embodiment also includes a plurality of locking springs for securing the heat pipe P to the board body 10. The first chip module C1 has a first upper locking spring 21b and a first lower locking spring 21a at its upper and lower ends, respectively. The terms "upper" and "lower" are used only to distinguish their relative positions. In some embodiments, the first upper locking spring 21b and the first lower locking spring 21a may have the same shape or different shapes.

[0020] In addition, the second chip module C2 has a second upper locking spring 22b and a second lower locking spring 22a at its top and bottom, respectively. The second upper locking spring 22b and the second lower locking spring 22a may have the same shape or different shapes.

[0021] Referring to Figure 2, the first lower locking spring 21a located below the first wafer module C1 and the second lower locking spring 22a located below the second wafer module C2 are jointly locked to the first common locking hole 13. The first upper locking spring 21b located above the first wafer module C1 and the second upper locking spring 22b located above the second wafer module C2 are jointly locked to the second common locking hole 14.

[0022] Specifically, the first upper locking spring 21b and the first lower locking spring 21a each include a first connecting portion 211 and a pair of first spring arms 212. The first spring arms 212 are connected to both ends of the first connecting portion 211. The first connecting portion 211 is connected to the contact base 31. The second upper locking spring 22b and the second lower locking spring 22a each include a second connecting portion 221 and a pair of second spring arms 222, with the second spring arms 222 connected to both ends of the second connecting portion 221. The second connecting portion 221 is connected to another contact base 32. One first spring arm 212 of the first lower locking spring 21a and one second spring arm 222 of the second lower locking spring 22a are jointly locked in the first common locking hole 13; the other first spring arm 212 of the first upper locking spring 21b and the other second spring arm 222 of the second lower locking spring 22b are jointly locked in the second common locking hole 14.

[0023] The following describes the design process of the planning board 10 in this embodiment. For ease of description, the directions such as top, bottom, left, and right are described according to the drawings and are for reference only. The first step is to define the first mounting hole 11 (or hole 1) based on the placement constraints of the first chip module C1. The reason for defining the position of the first mounting hole 11 first in this embodiment is that the four display memory modules G1, G2, G3, and G4 are located on the right side and below the first chip module C1, respectively. Due to the positional configuration of these display memory modules G1, G2, G3, and G4, the space for holes in the lower right corner of the first chip module C1 is maximally limited.

[0024] The second step is to define a second mounting hole 12 (or hole 2) in the upper right corner of the first chip module C1 according to the heat pipe design plan. Referring to Figure 2, the heat pipe design plan includes the number of heat pipes, width, and bending direction, etc.

[0025] The third step, as shown in Figure 1, involves symmetrically arranging the first locking hole 11 and the second locking hole 12 along the vertical centerline of the first wafer module C1. On the other side (the left side) of the first wafer module C1, a first common locking hole 13 (or hole 3) and a second common locking hole 14 (or hole 4) are defined in the usable space. In this embodiment, the first locking hole 11, the second locking hole 12, the first common locking hole 13, and the second common locking hole 14 form a trapezoidal shape to avoid the display memory G4.

[0026] Please refer to Figure 4. Without affecting the surrounding components of the first wafer module C1, the four mounting holes (11, 12, 13, 14) around the first wafer module C1 can also be changed to parallelograms.

[0027] In the fourth step, as shown in Figure 1, based on the positions of the first common locking hole 13 and the second common locking hole 14, the third locking hole 15 (or hole 5) and the fourth locking hole 16 (or hole 6) are defined in parallelogram arrangement in the usable space on the other side (left side) of the second wafer module C2.

[0028] In the fifth step, as shown in Figures 6A and 6B, based on the planned positions of the locking holes, this embodiment further adjusts the parameters of each locking spring to ensure that the locking pressure F of the spring arms on both sides of the same locking spring is the same. Furthermore, based on the geometric arrangement of the locking holes, the locking pressure F can be kept at the geometric center of the wafer module. The aforementioned parameters include the length L, width b, thickness h, and downward stroke δ of the spring arm. In addition, the locking pressure also takes into account the Young's modulus E of the locking spring material. The formula for the locking pressure F can be expressed as (δ*b*h³*E) / (4L³).

[0029] For example, according to the design in Figure 1, the first geometric shape S1 is trapezoidal, the locking pressure of the first spring arms 212 on both sides of the first locking lower spring 21a can be 0.677 kgf, and the locking pressure of the first spring arms 212 on both sides of the first locking upper spring 21b can be 1.075 kgf. In this way, the first chip module C1 can have symmetrical locking pressure, and the force is applied to the geometric center C10 of the first chip module C1.

[0030] For example, according to the plan in Figure 1, the second geometric figure S2 is a parallelogram. The two second spring arms along the diagonal of the parallelogram have the same locking pressure. For example, the second spring arm 222 on the right side of the second locking lower spring 22a and the second spring arm 222 on the left side of the second locking upper spring 22b can be 0.996 kgf, and the second spring arm 222 on the left side of the second locking lower spring 22a and the second spring arm 222 on the right side of the second locking upper spring 22b can be 0.740 kgf. In this way, the second chip module C2 can have symmetrical locking pressure, and the force is applied to the geometric center C20 of the second chip module C2.

[0031] Sixth step: common locking spring clips. In other words, the first locking lower spring clip 21a and the second locking lower spring clip 22a are jointly locked in the first common locking hole 13; the first locking upper spring clip 21b and the second locking upper spring clip 22b are jointly locked in the second common locking hole 14. Compared to the previous requirement of four locking holes for each chip module, this embodiment can save two locking holes. This not only meets the new design of the circuit board but also saves on its locking accessories.

[0032] [Second Embodiment]

[0033] Please refer to Figure 3. The difference between this embodiment and the previous embodiment lies in the shape of the locking springs. The first locking lower spring 23a and the second locking lower spring 24a are jointly locked in the first common locking hole 13. The first locking second spring 23b and the second locking upper spring 24b are jointly locked in the second common locking hole 14. The first locking hole 11, the second locking hole 12, the first common locking hole 13, and the second common locking hole 14 can be arranged into a trapezoidal first geometric shape S1. The first common locking hole 13, the second common locking hole 14, the third locking hole 15, and the fourth locking hole 16 can be arranged into a parallelogram second geometric shape S2.

[0034] [Third Embodiment]

[0035] Please refer to Figure 4. Different spaces can be allocated depending on the arrangement of components on the circuit board 100. For example, the first geometric shape S1' formed by the first locking hole 11, the second locking hole 12, the first common locking hole 13, and the second common locking hole 14 can be a parallelogram. Correspondingly, the second geometric shape S2' formed by the first common locking hole 13, the second common locking hole 14, the third locking hole 15, and the fourth locking hole 16 is also a parallelogram. The first lower locking spring 25a and the second lower locking spring 26a are jointly locked to the first common locking hole 13. The first second locking spring 25b and the second upper locking spring 26b are jointly locked to the second common locking hole 14.

[0036] [Fourth Embodiment]

[0037] Please refer to Figure 5. Different spaces can be provided depending on the arrangement of components on the circuit board 100. For example, the first geometric shape S1” formed by the first locking hole 11, the second locking hole 12, the first common locking hole 13, and the second common locking hole 14 can be trapezoidal (narrow at the top and wide at the bottom). Correspondingly, the second geometric shape S2” formed by the first common locking hole 13, the second common locking hole 14, the third locking hole 15, and the fourth locking hole 16 can also be trapezoidal (wide at the top and narrow at the bottom). The first lower locking spring 27a and the second lower locking spring 28a are jointly locked in the first common locking hole 13. The first upper locking spring 27b and the second upper locking spring 28b are jointly locked in the second common locking hole 14.

[0038] [Beneficial Effects of the Embodiments]

[0039] One of the beneficial effects of the present invention is that the circuit board provided by the present invention, through the technical solution of the first shared mounting hole and the second shared mounting hole, can reduce the total number of mounting holes by sharing the mounting holes, thereby increasing the space utilization of the circuit board, which is beneficial to the placement of electronic components and the routing of circuits, as well as increasing the stability of the structure.

[0040] The content disclosed above is only a preferred and feasible embodiment of the present invention, and is not intended to limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention specification and drawings are included in the scope of the patent application of the present invention. [Simplified Explanation of the Diagram]

[0041] Figure 1 is a partial top view of the circuit board of the present invention.

[0042] Figure 2 is a top view of the circuit board of the present invention combined with a heat pipe heat dissipation module.

[0043] Figure 3 is a schematic diagram of the circuit board of the second embodiment of the present invention.

[0044] Figure 4 is a schematic diagram of the circuit board of the third embodiment of the present invention.

[0045] Figure 5 is a schematic diagram of the circuit board of the fourth embodiment of the present invention.

[0046] Figure 6A is a side view schematic diagram of the relevant parameters of the locking spring of the present invention.

[0047] Figure 6B is a top view schematic diagram of the relevant parameters of the locking spring sheet of the present invention.

Claims

1. A circuit board, comprising: A plate having multiple locking holes, a first common locking hole, and a second common locking hole; A first chip module is disposed on the board; a second chip module is disposed on the board, and a gap is provided between the second chip module and the first chip module; and a plurality of locking springs are disposed on both sides of the first chip module and the second chip module, wherein two locking springs are jointly locked to a first common locking hole, and two other locking springs are jointly locked to a second common locking hole; wherein the first common locking hole is located on one side of the gap and between two of the locking holes, and the second common locking hole is located on the other side of the gap and between two other locking holes.

2. The circuit board as claimed in claim 1, wherein the locking springs include a first locking upper spring, a first locking lower spring, a second locking upper spring, and a second locking lower spring; the first locking upper spring and the first locking lower spring are respectively disposed on both sides of the first chip module; the second locking upper spring and the second locking lower spring are respectively disposed on both sides of the second chip module; the first locking lower spring and the second locking lower spring are jointly locked to the first common locking hole; and the first locking upper spring and the second locking upper spring are jointly locked to the second common locking hole.

3. The circuit board as claimed in claim 2, wherein the first upper locking spring and the first lower locking spring each include a first connecting portion and a pair of first spring arms, the pair of first spring arms being respectively connected to both ends of the first connecting portion; the second upper locking spring and the second lower locking spring each include a second connecting portion and a pair of second spring arms, the pair of second spring arms being respectively connected to both ends of the second connecting portion; one first spring arm of the first lower locking spring and one second spring arm of the second lower locking spring are jointly locked to the first common locking hole; one first spring arm of the first upper locking spring and one second spring arm of the second upper locking spring are jointly locked to the second common locking hole.

4. The circuit board as claimed in claim 1, wherein the mounting holes include a first mounting hole, a second mounting hole, a third mounting hole, and a fourth mounting hole; The first common locking hole is located between the first locking hole and the third locking hole; The second common locking hole is located between the second locking hole and the fourth locking hole.

5. The circuit board as claimed in claim 4, wherein the first locking hole, the second locking hole, the first common locking hole, and the second common locking hole form a first geometric shape, the geometric center of the first geometric shape being the same as the geometric center of the first wafer module.

6. The circuit board as claimed in claim 5, wherein the first geometry is a trapezoid or a parallelogram.

7. The circuit board as claimed in claim 4, wherein the third mounting hole, the fourth mounting hole, the first common mounting hole, and the second common mounting hole form a second geometry, the geometric center of the second geometry being the same as the geometric center of the second wafer module.

8. The circuit board as claimed in claim 7, wherein the second geometry is a trapezoid or a parallelogram.

9. The circuit board as claimed in claim 1, wherein the first chip module is a graphics processing unit and the second chip module is a central processing unit.

10. An electronic device comprising: The circuit board described in any one of claims 1 to 9; Multiple display memory modules are disposed on the circuit board and located around the first chip module; a heat pipe is connected to the first chip module and the second chip module; and at least one cooling fan is connected to the heat pipe.

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