Heat dissipation device

Abstract

A heat dissipation device is suitable for mounting on an electronic component, the electronic component including a heating surface coated with a liquid metal. The heat dissipation device includes a base. The base has a bottom surface facing the heating surface and an inner surface connected to the bottom surface, defining a downward-facing groove. The inner surface surrounds the liquid metal, placing the liquid metal within the groove. The liquid metal is confined within the groove, thus preventing it from flowing out of the groove and avoiding short circuits or corrosion of components or other areas on the electronic component due to contact with the overflowing liquid metal. Furthermore, the inner surface surrounding the liquid metal is far from the heating surface of the electronic component, so that even with relative movement between them, there will be no friction against the gallium oxide film layer of the liquid metal, thereby preventing blackening.

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