Heat dissipation structure of electronic components

Abstract

A heat dissipation structure for an electronic component includes an electronic component, a pair of heat sinks for conducting heat to the electronic component, and a circuit board. The electronic component has a package housing, a plurality of pins, and a top-mounted heat sink. The circuit board has a plurality of first copper foils for bonding the pins, and a second copper foil for bonding the heat sink. The second copper foil is divided into at least one first portion for bonding the heat sink, and a second portion connecting the first portion. When the electronic component is mounted on the circuit board, the second portion contacts the package housing of the electronic component but does not form an adhesive relationship, thereby improving the heat dissipation efficiency of the electronic component. Furthermore, in practical applications, this invention is not limited to implementation with a single electronic component; it can also be implemented with a plurality of electronic components arranged in parallel.

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