Heat dissipation structure of electronic components

Abstract

A heat dissipation structure for an electronic component includes an electronic component, a heat sink, and a circuit board. The electronic component has a package housing, a plurality of pins exposed within the package housing, and a top heat sink exposed within the package housing. The heat sink is formed with a space for accommodating the electronic component and an injection channel communicating with the space. The injection channel allows a solid thermally conductive medium to be injected into the space, causing thermal conductivity between the top heat sink and the heat sink. The circuit board has a plurality of first copper foils for bonding the pins and a second copper foil for bonding the heat sink. Furthermore, the number of electronic components in this invention can be multiple, and the multiple electronic components can be arranged in parallel.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation structure for electronic components, and more particularly to a heat dissipation structure that increases heat dissipation efficiency. [Previous Technology]

[0002] Electronic components easily generate waste heat during operation, so manufacturers mostly use heat sinks to dissipate heat from electronic components. One common technique is to attach the heat sink to the electronic component, allowing the heat sink to directly contact the electronic component for heat conduction. On the other hand, a thermally conductive medium can be applied to the surface of the electronic component, and then the heat sink can be positioned according to the location of the electronic component. The thermally conductive medium fills the gap between the electronic component and the heat sink, thus forming a path for heat conduction from the electronic component to the heat sink.

[0003] Accordingly, the TWM320289U provides an improved surface-mount heat dissipation structure, which includes a circuit board, a heat dissipation element, and a thermally conductive adhesive. The heat dissipation element has a heat dissipation cover with a filling hole and a receiving space, wherein a light-emitting element is disposed therein. The TWM320289U solders the light-emitting element to the circuit board, electrically connects it using copper foil on the circuit board, and then fits the heat dissipation cover to one side of the light-emitting element, so that the light-emitting element is located within the receiving space of the heat dissipation element, and fills the filling hole with the thermally conductive adhesive to achieve the effect of heat conduction of the light-emitting element.

[0004] On the other hand, the TWM320289U technology requires the heat dissipation element to be integrated with the electronic component, rather than simply being positioned by bonding it to the circuit board. This makes it difficult to implement in practice when the goal is to further improve the production capacity of electronic components through automated operations. Furthermore, the aforementioned conventional technology of attaching heat sinks in a locking manner is more complex and also not conducive to the implementation of automated operations. [Summary of the Invention]

[0005] The main objective of this invention is to solve the problem that conventional heat dissipation structures are inconvenient to set up when used in automated operations.

[0006] A secondary objective of the present invention is to improve the heat dissipation effect of the heat dissipation structure of electronic components.

[0007] To achieve the above objectives, the present invention provides a heat dissipation structure for an electronic component, comprising an electronic component, a heat sink, and a circuit board. The electronic component has a package housing, a plurality of pins exposed in the package housing, and a top heat sink exposed in the package housing. The heat sink is formed with a space that allows the heat sink to span over the electronic component and an injection channel communicating with the space. When the heat sink spans over the electronic component, the pins are not allowed to enter the space. The injection channel allows a solid thermally conductive medium to be injected into the space, and the solid thermally conductive medium causes the top heat sink and the heat sink to have a thermal conduction relationship. The circuit board is provided with a plurality of first copper foils and a second copper foil. The first copper foils provide bonding for the pins of the electronic component, and the second copper foil provides bonding for the heat sink.

[0008] In one embodiment, the heat sink includes a plurality of fins, and the injection channel is formed in one of the fins.

[0009] In one embodiment, the injection channel has a first port exposed to the heat sink and a second port facing the space, the second port being larger than the first port.

[0010] In one embodiment, the injection channel has an injection segment connecting the first port and a gradually expanding segment connecting the injection segment and the second port.

[0011] In one embodiment, the radiator is formed with a receiving groove that is part of the space and the receiving groove is connected to the second port.

[0012] In one embodiment, the second copper foil is divided into at least one first portion for bonding the heat sink, and a second portion for connecting the at least one first portion. The second portion contacts the package housing of the electronic component when the electronic component is disposed on the circuit board, but does not form an adhesive relationship.

[0013] In one embodiment, the heat sink is mounted across the electronic component, the heat sink includes two adhesive feet, the second copper foil includes two of the first portions, and the second portion of the second copper foil is located between the two first portions.

[0014] In one embodiment, the space on the heat sink is formed by a notch.

[0015] In one embodiment, the radiator is formed with a receiving groove that is part of the space and the receiving groove is connected to the second port.

[0016] In one embodiment, at least one of the first portions includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

[0017] In one embodiment, the first copper foils are divided into two spaced groups, and the second copper foil is provided on at least three sides of each of the two groups, with the second portion of the second copper foil located between the two groups.

[0018] In one embodiment, the first part respectively includes a heat sink bonding area and two auxiliary heat dissipation areas connected to the heat sink bonding area.

[0019] In one embodiment, the heat dissipation structure includes a plurality of the electronic components, and the space of the heat sink provides for accommodating the plurality of the electronic components therein.

[0020] In one embodiment, the heat dissipation structure includes a plurality of electronic components, the heat sink forms a plurality of spaces and a plurality of injection channels, each of the plurality of injection channels is disposed in one of the plurality of spaces, the plurality of electronic components are respectively housed in the plurality of spaces, and the number of the plurality of electronic components housed in each of the plurality of spaces is greater than or equal to 1.

[0021] The present invention, through the foregoing embodiments, has the following characteristics compared to conventional methods:

[0022] In addition to serving as an adhesive point during the automated implementation of the heat sink, the second copper foil of the present invention can also serve as a heat dissipation pathway. The heat sink is provided with an injection channel, allowing the solid heat-conducting medium to be injected into the space via the injection channel. The overall structure of the present invention requires only simple positioning, adhesive, and injection actions during automated operation, making it more conducive to automated implementation compared to conventional methods. In addition to the foregoing, the heat dissipation effect of the structure disclosed in the present invention can be effectively improved. The electronic components included in the heat dissipation structure of the present invention are not limited to a single component but can be implemented in multiple ways, and the structure of the heat sink is adjusted according to the implementation.

Implementation Method

[0023] The detailed description and technical content of this invention are now explained in conjunction with the accompanying drawings:

[0024] Referring to Figures 1 to 3, the present invention provides a heat dissipation structure 20 for an electronic component. The heat dissipation structure 20 includes an electronic component 21, a heat sink 22, and a circuit board 23. The electronic component 21 may be an electronic component suitable for surface mount technology (SMT). The electronic component 21 has a package housing 211, a plurality of pins 212 exposed in the package housing 211, and a top heat sink 213 exposed in the package housing 211. The appearance of the package housing 211 and the pins 212 can be adjusted according to usage requirements. Continuing the explanation, the heat sink 22 is formed with a space 221 that allows the heat sink 22 to span over the electronic component 21 and an injection channel 222 communicating with the space 221. When the heat sink 22 spans over the electronic component 21, the pins 212 are not allowed to enter the space 221. The injection channel 222 allows a solid thermally conductive medium 40 to be injected into the space 221. The solid thermally conductive medium 40 enables thermal conduction between the top heat sink 213 and the heat sink 22. Further explanation: the top position of the top heat sink 213 is when the electronic component 21 is mounted on the circuit board 23, located on the side of the electronic component 21 facing away from the circuit board 23. Furthermore, the top heat sink 213 may partially cover the top surface of the electronic component 21 or completely cover the top surface of the electronic component 21. On the other hand, after the solid thermally conductive medium 40 fills the space 221, it can create a thermal conduction relationship between the top heat sink 213 and the heat sink 22 by filling the space 221. Furthermore, the solid thermally conductive medium 40 can also create a thermal conduction relationship between the package shell 211 and the heat sink 22. The solid thermally conductive medium 40 is a thermal paste or a thermal adhesive. Continuing the description, the circuit board 23 is provided with a plurality of first copper foils 231 and a second copper foil 232. The first copper foils 231 provide for bonding the pins 212 of the electronic components 21, and the second copper foil 232 provides for bonding the heat sink 22.

[0025] Please refer to Figures 2 to 6. The implementation of the heat dissipation structure 20 will now be described. When the heat dissipation structure 20 is set up in an automated operation, the pins 212 of the electronic component 21 are first bonded to the first copper foils 231. Next, the heat sink 22 is placed in relation to the position of the electronic component 21 and bonded to the second copper foil 232. At this time, the electronic component 21 is located in the space 221 of the heat sink 22, as shown in Figure 5. Next, the solid thermally conductive medium 40 is injected into the injection channel 222 using an injection structure 50 in the automated operation. When the solid thermally conductive medium 40 is injected into the space 221, it contacts the heat sink 22 and the electronic component 21 to form a heat conduction relationship, as shown in Figure 4. In this way, the setting of the heat dissipation structure 20 is completed. As described above, the heat dissipation structure 20 of the present invention only requires simple positioning, adhesion, and injection actions during automated operation. These actions can all be mechanically automated, which is more conducive to automation compared to conventional methods that require additional manual locking or fitting. Furthermore, during implementation, the waste heat generated by the electronic component 21 can be dissipated not only through the heat sink 22, but also the heat at the location of the electronic component 21 can be dissipated through the heat sink 22 via the second copper foil 232 during conduction on the circuit board 23. Therefore, the heat dissipation structure 20 of the present invention not only facilitates automated implementation but also improves the overall heat dissipation effect.

[0026] Referring again to Figure 3, in one embodiment, the injection channel 222 has a first port 223 exposed in the heat sink 22 and a second port 224 facing the space 221. The second port 224 is larger than the first port 223. The present invention increases the flow range of the solid thermally conductive medium 40 into the space 221 through the design of the second port 224, avoiding excessive accumulation of the solid thermally conductive medium 40 in a single location. In one embodiment, the injection channel 222 may have an injection section 225 connecting the first port 223 and a gradually expanding section 226 connecting the injection section 225 and the second port 224. The injection channel 222 does not have a change in diameter in the injection section 225. The implementation of the gradually expanding section 226 facilitates the injection of the solid thermally conductive medium 40 and avoids the influence of a single-diameter channel design on the injection.

[0027] Referring again to Figures 4 and 5, in one embodiment, the second copper foil 232 is divided into at least one first portion 233 for bonding the heat sink 22, and a second portion 234 connecting the at least one first portion 233. When the electronic component 21 is disposed on the circuit board 23, the second portion 234 contacts the package shell 211 of the electronic component 21 but does not form an adhesive relationship. Furthermore, when the second copper foil 232 is positioned, in addition to being disposed adjacent to the first copper foils 231, the second portion 234 of the second copper foil 232 is located at the predetermined position for placing the electronic component 21. The second portion 234 is not intended to fix the electronic component 21, but rather to provide a place for the package shell 211 of the electronic component 21 to form a direct contact thermal conduction relationship.

[0028] Please refer to Figures 2 to 6. In this embodiment, when the heat dissipation structure 20 is set up in an automated operation, the pins 212 of the electronic component 21 are first bonded to the first copper foils 231. At the same time, the second portion 234 of the second copper foil 232 is located below the electronic component 21 and contacts the package shell 211 of the electronic component 21. Next, the heat sink 22 is placed in relation to the position of the electronic component 21 and bonded to at least one first portion 233 of the second copper foil 232. At this time, the electronic component 21 is disposed in the space 221 of the heat sink 22, as shown in Figure 5. Finally, the solid thermal conductive medium 40 is injected into the space 221 through the injection channel 222, so that the solid thermal conductive medium 40 is located in the space 221 and contacts the heat sink 22 and the electronic component 21, forming the aforementioned heat conduction relationship, as shown in Figure 4. In this embodiment, the provision of the second copper foil 232 allows the electronic component 21 to dissipate heat in multiple ways. For example, the aforementioned multiple ways can lead to the removal of waste heat from the electronic component 21, which is then guided through the physical thermally conductive medium 40 to the heat sink 22, where the heat sink 22 exchanges heat with the outside environment. In addition to the above, the waste heat can also be guided from the electronic component 21 to the second portion 234 of the second copper foil 232, and then from the second portion 234 to the at least one first portion 233. When the waste heat is introduced into the at least one first portion 233, it can be conducted to the circuit board 23 or the heat sink 22. The multiple ways described above can be implemented simultaneously, as shown in FIG6. In this way, the heat dissipation structure 20 of the present invention has better heat dissipation efficiency for the electronic component 21 compared with conventional methods.

[0029] Referring again to Figures 2 to 6, in one embodiment, the heat sink 22 includes two adhesive feet 227, the second copper foil 232 includes two first portions 233, and the second portion 234 of the second copper foil 232 is located between the two first portions 233. Specifically, when the heat sink 22 is installed, the heat sink 22 is positioned with the two adhesive feet 227 corresponding to the two first portions 233, and the two first portions 233 are located on opposite sides of the second portion 234. After the heat dissipation structure 20 is installed, the heat sink 22 spans across the electronic component 21. In another embodiment, the space 221 on the heat sink 22 is formed by a notch 228. The two adhesive feet 227 can be formed on both sides of the notch 228, so that when the heat sink 22 is set and positioned in an automated operation, the notch 228 can be set according to the position of the electronic component 21, and the two adhesive feet 227 can be set on the two first parts 233 to more accurately place and position the heat sink 22.

[0030] Continuing from the above, in another embodiment, at least one of the two first portions 233 includes a heat sink bonding area 235 and an auxiliary heat dissipation area 236 connected to the heat sink bonding area 235. The auxiliary heat dissipation area 236 does not contact the electronic component 21 and the heat sink 22, and the auxiliary heat dissipation area 236 increases the area of ​​the second copper foil 232 that directly exchanges heat with the outside. When the heat sink bonding area 235 receives the waste heat transferred by the second portion 234, the heat sink bonding area 235 can transfer the waste heat to the auxiliary heat dissipation area 236, and the auxiliary heat dissipation area 236 directly exchanges heat with the outside, thereby improving the heat dissipation efficiency of the heat dissipation structure 20. Furthermore, in another embodiment, the two first portions 233 respectively include the heat sink bonding area 235 and two auxiliary heat dissipation areas 236 connected to the heat sink bonding area 235. The heat sink bonding area 235 is located between the two auxiliary heat dissipation areas 236, so that each of the two first portions 233 has the auxiliary heat dissipation effect provided by the two auxiliary heat dissipation areas 236.

[0031] Referring again to Figures 3 to 6, in one embodiment, the first copper foils 231 are divided into two spaced groups 237. Each of the two groups 237 is disposed facing at least the second portion 234 of the second copper foil 232, and the pins 212 of the electronic component 21 are bonded to the positions corresponding to the two groups 237. In another embodiment, the second copper foil 232 is disposed on at least three sides of each of the two groups 237, and the second portion 234 of the second copper foil 232 is located between the two groups 237. That is, each of the two first portions 233 has two auxiliary heat dissipation areas 236, and the two auxiliary heat dissipation areas 236 are located on two opposite sides of the heat sink bonding area 235, and face at least two of the at least three sides of one of the two groups 237. The second portion 234 faces one of the at least three sides, so that the second copper foil 232 approximately surrounds each of the two groups 237, making the overall heat dissipation effect of the heat dissipation structure 20 more comprehensive.

[0032] Continuing from the above, in another embodiment, the heat sink 22 includes a plurality of fins 229. These fins 229 extend away from the electronic component 21 and are spaced apart from each other. The fins 229 increase the contact area between the heat sink 22 and the outside environment, thereby improving the heat exchange capacity of the heat sink 22. The injection channel 222 is formed in one of the fins 229, and the position of the injection channel 222 is primarily aligned with the position of the electronic component 21.

[0033] Referring to Figure 7, in one embodiment, the heat sink 22 is formed with a receiving groove 220, which is part of the space 221 and communicates with the second port 224. After the heat sink 22 is positioned, the receiving groove 220 faces the electronic component 21. The area of ​​the receiving groove 220 can be determined according to the user's expectation of the area of ​​the solid thermal conductive medium 40 in contact with the electronic component 21, so as to avoid the solid thermal conductive medium 40 overflowing the space 221.

[0034] Continuing with the preceding technical concept, the heat dissipation structure 20 of the electronic component of the present invention is not limited to providing heat dissipation for a single electronic component 21. In one embodiment where the heat dissipation structure 20 includes a plurality of electronic components 21, the space 221 of the heat sink 22 can be designed to simultaneously accommodate a plurality of electronic components 21, and the solid thermally conductive medium 40 injected into the space 221 via the injection channel 222 contacts the plurality of electronic components 21 within the space 221, as illustrated in FIG8. In addition to the aforementioned embodiment, the heat sink 22 can also be formed into a plurality of spaces 221 and a plurality of injection channels 222, as shown in FIG9. The plurality of spaces 221 are spaced apart, and the portion of the heat sink 22 located between any two adjacent spaces 221 can be implemented by the adhesive foot 227. Therefore, the position of the circuit board 23 corresponding to the aforementioned adhesive foot 227 can be a part of the second copper foil 232. In this embodiment, the second copper foil 232 can be slightly fishbone shaped. Referring to Figure 10, based on the aforementioned distinction between the first portion 233 and the second portion 234, the second copper foil 232 can be segmented sequentially into the first portion 233, the second portion 234, the first portion 233, the second portion 234, and the first portion 233. On the other hand, each of the plurality of injection channels 222 corresponds to one of the plurality of spaces 221, and the plurality of electronic components 21 are respectively housed within the plurality of spaces 221. Further, the number of the plurality of electronic components 21 disposed within each of the plurality of spaces 221 is greater than or equal to one; that is, the size of each of the plurality of spaces 221 can be adjusted according to implementation requirements, so that each of the plurality of spaces 221 can accommodate at least one of the corresponding number of the plurality of electronic components 21 based on implementation requirements. As previously stated, the plurality of electronic components 21 in the aforementioned embodiments are connected in parallel in the circuit layout. [Simplified Explanation of the Diagram]

[0035] Figure 1 is a schematic diagram of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 2 is an exploded view of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 3 is a top view of a partial structure of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 4 is a cross-sectional view (I) of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 5 is a cross-sectional view (II) of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 6 is a cross-sectional view (III) of the first embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 7 is a cross-sectional view of the second embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 8 is a cross-sectional view of the third embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 9 is a schematic diagram of the fourth embodiment of the heat dissipation structure of the electronic component of the present invention. Figure 10 is a schematic diagram of the copper foil layout of the fourth embodiment of the heat dissipation structure of the electronic component of the present invention.

Claims

1. A heat dissipation structure for an electronic component, comprising: an electronic component having a package housing, a plurality of pins exposed in the package housing, and a top heat sink exposed in the package housing; a heat sink having a space for the heat sink to span over the electronic component and an injection channel communicating with the space, wherein when the heat sink spans over the electronic component, the pins are not allowed to enter the space, and the injection channel allows a solid thermally conductive medium to be injected into the space, the solid thermally conductive medium causing thermal conduction between the top heat sink and the heat sink; and a circuit board having a plurality of first copper foils and a second copper foil, the first copper foils providing bonding for the pins of the electronic component, and the second copper foil providing bonding for the heat sink.

2. The heat dissipation structure of the electronic component as described in claim 1, wherein, The heatsink comprises a plurality of fins, and the injection channel is formed in one of these fins.

3. The heat dissipation structure of the electronic component as described in claim 1 or 2, wherein, The injection channel has a first port exposed to the heat sink and a second port facing the space, the second port being larger than the first port.

4. The heat dissipation structure of the electronic component as described in claim 3, wherein, The injection channel has an injection segment connecting the first port and a gradually expanding segment connecting the injection segment and the second port.

5. The heat dissipation structure of the electronic component as described in claim 4, wherein, The radiator is formed with a receiving groove that is part of the space and is connected to the second port.

6. The heat dissipation structure of the electronic component as described in claim 1, wherein, The second copper foil is divided into at least one first portion for bonding the heat sink, and a second portion connecting the at least one first portion. The second portion contacts the package of the electronic component when the electronic component is mounted on the circuit board, but does not form an adhesive relationship.

7. The heat dissipation structure of the electronic component as described in claim 6, wherein, The heat sink is mounted across the electronic component. The heat sink includes two adhesive feet. The second copper foil includes two portions of the first portion, and the second portion of the second copper foil is located between the two portions of the first portion.

8. The heat dissipation structure of the electronic component as described in claim 7, wherein, The space on the radiator is formed by a notch.

9. The heat dissipation structure of the electronic component as described in claim 7, wherein, The first part includes at least one of a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

10. The heat dissipation structure of the electronic component as described in claim 6, wherein, The first copper foils are divided into two spaced groups, and the second copper foil is provided on at least three sides of each of the two groups, with the second portion of the second copper foil located between the two groups.

11. The heat dissipation structure of the electronic component as described in claim 6, wherein, The first part includes a heat sink bonding area and two auxiliary heat dissipation areas connected to the heat sink bonding area.

12. The heat dissipation structure of the electronic component as described in claim 1, wherein, The space on the radiator is formed by a notch.

13. The heat dissipation structure of the electronic component as described in claim 1, wherein, The heat dissipation structure includes a plurality of the electronic components, and the space of the heat sink provides for accommodating the plurality of the electronic components therein.

14. The heat dissipation structure of the electronic component as described in claim 1, wherein, The heat dissipation structure includes a plurality of electronic components, the heat sink forms a plurality of spaces and a plurality of injection channels, each of the plurality of injection channels is disposed in one of the plurality of spaces, the plurality of electronic components are respectively housed in the plurality of spaces, and each of the plurality of spaces provides housing for a plurality of electronic components of a number greater than or equal to 1.

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