Cooling system for liquid immersion cooling of electronic components

Abstract

The present invention relates to a cooling system (1) for liquid immersion cooling of an electronic component (10), comprising a container (3) having a container wall (31), the container having an internal reservoir (34) for a liquid heat transfer fluid, and a positioning device (35) for the electronic component (10) provided in the container, wherein the container (3) has an air chamber (5) for a gaseous heat transfer fluid, and at least one heat exchange device (6) for forming a liquid heat transfer fluid (4), the liquid heat transfer fluid system being transported to the reservoir (34) under gravity. According to the present invention, at least one filter device (2) is provided in the return path of the liquid heat transfer fluid (4) from the at least one heat exchange device (6) to the reservoir (34) for the liquid heat transfer fluid, the heat exchange device (6) being disposed in the air chamber (5) of the container (3), and the filter device (2) located in the return of the liquid fluid (4) being disposed below the at least one heat exchange device (6).

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