Two phase shower immersion cooling system for data center: power down sequence

TW202634905APending Publication Date: 2026-08-16美商振宇研創
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Patent Information

Application Number
TW114148100
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-12-05
Filing Date
2025-12-09
Publication Date
2026-08-16

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Abstract

A cooling system, configured to perform a cooling operation, the cooling system including a coolant chamber; wherein liquid coolant and coolant vapor are in the coolant chamber during the cooling operation of the cooling system; wherein circuit boards are disposed within the coolant chamber, and the cooling operation is performed via contact of the liquid coolant with the circuit boards; wherein the cooling system performs a power down sequence before the coolant chamber is unsealed; wherein the power down sequence is configured to remove the liquid coolant remained on circuit boards after the cooling operation before the coolant chamber is opened.
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