Solder joint cooling system and assembly method thereof

Abstract

The invention relates to a solder joint cooling system, including a printed circuit board, an electrical component, an enclosure portion and a cooling sink. The printed circuit board includes a through hole. A pin of the electrical component is plugged into the through hole. The printed circuit board includes at least one conductive layer, at least one insulating layer, a component side, and a solder side opposite to the component side. A first conductive layer of the at least one conductive layer is disposed on the solder side. The electrical component is mounted on the component side, and the pin of the electrical component is soldered to a pad on the solder side and connected to the pad via a solder joint. The enclosure portion is connected to the printed circuit board and the cooling sink. The enclosure portion, the solder side of the printed circuit board, and the cooling sink together surround an enclosed space. The solder joint is disposed inside the enclosed space, and the enclosed space is filled with a thermally conductive and electrically insulating gap filler. The invention also relates to a method for assembling the solder joint cooling system.

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