Integrated chip and method of forming the same

TW202634917APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114112724
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-13
Filing Date
2025-04-02
Publication Date
2026-08-16

Smart Images

  • Figure TWG2TA001072418_001
    Figure TWG2TA001072418_001
  • Figure TWG2TA001072418_002
    Figure TWG2TA001072418_002
  • Figure TWG2TA001072418_003
    Figure TWG2TA001072418_003
Patent Text Reader

Abstract

An integrated chip includes a write transistor arranged over an upper surface of a substrate, and a read transistor arranged over the write transistor. The write transistor includes a first channel region vertically extending in a first direction perpendicular to the upper surface of the substrate, a first gate region vertically extending in the first direction and arranged along the first channel region, and a first source / drain region and a second source / drain region respectively in contact with a top portion and a bottom portion of the first channel region. The read transistor includes a second channel region extending in a second direction in parallel with the upper surface and a second gate region extending in a third direction in parallel with the upper surface and perpendicular to the second direction. The second gate region is arranged under the second channel region and over the first channel region.
Need to check novelty before this filing date? Find Prior Art