Semiconductor device and method of forming the same
TW202634950APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW114122977
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-04-25
- Filing Date
- 2025-06-19
- Publication Date
- 2026-08-16
Smart Images

Figure TWG2TA001072504_001 
Figure TWG2TA001072504_002 
Figure TWG2TA001072504_003
Abstract
A semiconductor structure and a method of fabricating the structure are disclosed. The method includes forming a superlattice structure with a nanostructured layer and a sacrificial nanostructured layer on a base structure on a substrate, forming a polysilicon structure on the superlattice structure, and forming a S / D region in the superlattice structure. A S / D portion of the S / D region extends above the nanostructured layer. The method further includes modifying a thickness of the S / D portion, depositing a dielectric layer on the modified S / D portion, and replacing the polysilicon structure and the sacrificial nanostructured layer with a gate structure.
Need to check novelty before this filing date? Find Prior Art