Semiconductor structure and fabrication method thereof

TW202634986APending Publication Date: 2026-08-16NAN YA TECH
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114106644
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-10
Filing Date
2025-02-24
Publication Date
2026-08-16

Smart Images

  • Figure TWG2TA001072378_001
    Figure TWG2TA001072378_001
  • Figure TWG2TA001072378_002
    Figure TWG2TA001072378_002
  • Figure TWG2TA001072378_003
    Figure TWG2TA001072378_003
Patent Text Reader

Abstract

A semiconductor structure is provided. The semiconductor structure includes a carrier substrate, a semiconductor fin structure, a gate insulation layer, and a gate structure. The semiconductor fin structure is disposed over the carrier substrate and extending along a first direction. A width of the semiconductor fin structure varies along a second direction perpendicular to a top surface of the carrier substrate, with a widest portion of the semiconductor fin structure located at a middle of the semiconductor fin structure. The gate insulation layer is disposed on the semiconductor fin structure. The gate structure is disposed on the gate insulation layer.
Need to check novelty before this filing date? Find Prior Art