Semiconductor structure and fabrication method thereof
TW202634986APending Publication Date: 2026-08-16NAN YA TECH
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Patent Information
- Application Number
- TW114106644
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-10
- Filing Date
- 2025-02-24
- Publication Date
- 2026-08-16
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Abstract
A semiconductor structure is provided. The semiconductor structure includes a carrier substrate, a semiconductor fin structure, a gate insulation layer, and a gate structure. The semiconductor fin structure is disposed over the carrier substrate and extending along a first direction. A width of the semiconductor fin structure varies along a second direction perpendicular to a top surface of the carrier substrate, with a widest portion of the semiconductor fin structure located at a middle of the semiconductor fin structure. The gate insulation layer is disposed on the semiconductor fin structure. The gate structure is disposed on the gate insulation layer.
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