Seal ring designs supporting efficient die to die routing
TW202634989APending Publication Date: 2026-08-16APPLE INC
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Patent Information
- Application Number
- TW115117086
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-08-30
- Filing Date
- 2022-02-23
- Publication Date
- 2026-08-16
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Abstract
Chip sealing designs to accommodate die-to-die communication are described. In an embodiment, a chip structure includes a split metallic seal structure including a lower metallic seal and an upper metallic seal with overlapping metallization layers, and a through seal interconnect navigating through the split metallic seal structure.
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