Electronic device

Abstract

An electronic device includes a substrate, a first metal layer, a semiconductor layer and a second metal layer. The first metal layer is disposed on the substrate. The semiconductor layer is disposed on the substrate, and includes a first channel area, a connection area and a second channel area, wherein the first channel area and the second channel area overlap the first metal layer, and the connection area connects the first channel area and the second channel area. The second metal layer is disposed on the semiconductor layer, and includes a first pattern and a second pattern, wherein the first pattern is electrically connected to the first channel area, and the second pattern is electrically connected to the second channel area. The first channel area has a first width, the second channel area has a second width, and the first width is different from the second width.

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