Semiconductor devices and manufacturing methods thereof

Abstract

This invention provides a semiconductor device capable of adequately filling via contacts and suppressing the rise of wiring resistance, and a method for manufacturing the same. The semiconductor device of this embodiment includes a first wiring and a second wiring disposed along a first direction of the first wiring. A first contact electrically connects the first wiring and the second wiring. A third wiring is narrower than the second wiring and the first contact in a second direction intersecting the first direction, and is disposed along the second direction of the second wiring. The first contact is made of a first conductive material. The second and third wirings are made of a second conductive material with lower resistance than the first conductive material.

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