Semiconductor device
TW202635029APending Publication Date: 2026-08-16UNIKORN SEMICONDUCTOR CORPORATION
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Patent Information
- Application Number
- TW114104802
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-10
- Publication Date
- 2026-08-16
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Abstract
A semiconductor device includes a semiconductor stack, an insulating structure, a first contact layer, a first transparent conductive layer, and a second transparent conductive layer. The semiconductor stack includes a lower region and a mesa region. The mesa region includes an active structure and has a first upper surface and a first side surface, while the lower region has a second side surface and a second upper surface connecting the second side surface and the first side surface. The insulating structure includes a first portion covering the first upper surface, a second portion covering the first side surface, and a third portion covering the second side surface, with an opening located on the first upper surface. The first contact layer is located on the second upper surface. The first transparent conductive layer fills the opening and covers the first portion but does not cover the second portion. The second transparent conductive layer is separated from the first transparent conductive layer and continuously covers the first contact layer and the third portion.
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