Electronic device and manufacturing method thereof

Abstract

A method for manufacturing an electronic device includes the following steps: providing a carrier and a plurality of electronic components disposed on the carrier, wherein the electronic components include a first electronic component and a second electronic component; providing a circuit substrate, wherein the circuit substrate includes a plurality of serial pad combinations, one of the serial pad combinations includes a first pad, a second pad, a third pad and a fourth pad, the second pad is electrically connected to the third pad; simultaneously picking up the first electronic component and the second electronic component; and simultaneously transferring the first electronic component and the second electronic component to the circuit substrate. The first electronic component is correspondingly disposed on the first pad and the second pad, the second electronic component is correspondingly disposed on the third pad and the fourth pad, and the first electronic component and the second electronic component are connected in series.

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