Bleed and feed method for slurry recycling

Abstract

Embodiments of the present disclosure generally relate to planarization of surfaces on substrates. More specifically, embodiments of the present disclosure relate to methods and systems for polishing a substrate. In one or more embodiments, the method includes polishing a device side of the substrate in the presence of a first polishing fluid, the first polishing fluid comprising a first ratio of recycled slurry to new slurry; and polishing the device side of the substrate in the presence of a second polishing fluid, the second polishing fluid comprising a second ratio of recycled slurry to new slurry that is smaller than the first ratio of recycled slurry to new slurry.

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