Membrane design for rectangular substrate polishing by chemical mechanical polishing

Abstract

A carrier head assembly for a chemical mechanical polishing system is provided. The carrier head assembly includes a base assembly and a rectangular membrane. The rectangular membrane extends below and is coupled to the base assembly. The rectangular membrane defines pressurizable chambers including a first pressurizable chamber and a second pressurizable chamber arranged, at least in part, in a chamber stack in which the first pressurizable chamber is stacked on the second pressurizable chamber. The first and second pressurizable chambers are pressurizable to different pressures to create a pressure differential that provides a downward force through a side wall forming, at least in part, the second pressurizable chamber.

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