Semiconductor manufacturing steps using adhesive tape and semiconductor wafer manufacturing methods

Abstract

The present invention aims to provide an adhesive tape for semiconductor manufacturing processes that can effectively transfer a large number of semiconductor wafers even when the size of the semiconductor wafer is small. Furthermore, the present invention aims to provide a semiconductor wafer using the adhesive tape for semiconductor manufacturing processes. The present invention is an adhesive tape for semiconductor manufacturing processes having a first adhesive layer and a substrate layer. At least one layer of the adhesive tape contains an antistatic agent. The adhesive tape is used in a semiconductor wafer manufacturing method that includes a transfer step in which a semiconductor wafer is continuously disposed on the first adhesive layer, and after the semiconductor wafer is peeled off from the first adhesive layer, the peeled semiconductor wafer is brought into contact with a carrier material. In the transfer step, the peeling of the semiconductor wafer from the first adhesive layer and the bringing of the peeled semiconductor wafer into contact with the carrier material are performed continuously. none