Substrate processing method and substrate processing system

Abstract

The present invention provides a substrate processing method and a substrate processing system; the substrate processing method processes an overlapping substrate having a first surface of a first substrate and a surface of a second substrate bonded together, the first substrate having the first surface and a second surface being the side opposite to the first surface, and the first surface having a laminated film formed thereon, the laminated film comprising a laser absorption layer for absorbing laser light of a predetermined wavelength and a device layer; the substrate processing method includes the following steps: irradiating the laser absorption layer with laser light from the second surface side of the first substrate; and transferring the device layer from the first substrate to the second substrate by separating the first substrate from the second substrate of the overlapping substrate.

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