Substrate processing device

TW202635088APending Publication Date: 2026-08-16SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115103765
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-14
Filing Date
2026-01-30
Publication Date
2026-08-16

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    Figure TWG2TA001073446_003
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Abstract

The present invention provides a substrate processing apparatus that can improve the circumferential temperature uniformity of a substrate. The substrate processing apparatus (1) of the embodiment includes: a rotating platform (11) facing the substrate (W) held on a holding member (12) at a distance from each other and having a facing surface (11a) with a diameter larger than that of the substrate (W), so that the substrate (W) held on the holding member (12) is rotated; a processing liquid supply unit (20) that supplies processing liquid (Lp) to the side of the rotating substrate (W) opposite to the facing surface (11a); and a heating unit (50) that irradiates heating light from above the side of the substrate (W) to which the processing liquid (Lp) is supplied, wherein the light absorption rate of the facing surface (11a) is at least 90% in the area where it does not overlap with the substrate (W) when viewed from above.
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