Substrate processing device
TW202635088APending Publication Date: 2026-08-16SHIBAURA MECHATRONICS CORP
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115103765
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-14
- Filing Date
- 2026-01-30
- Publication Date
- 2026-08-16
Smart Images

Figure TWG2TA001073446_001 
Figure TWG2TA001073446_002 
Figure TWG2TA001073446_003
Abstract
The present invention provides a substrate processing apparatus that can improve the circumferential temperature uniformity of a substrate. The substrate processing apparatus (1) of the embodiment includes: a rotating platform (11) facing the substrate (W) held on a holding member (12) at a distance from each other and having a facing surface (11a) with a diameter larger than that of the substrate (W), so that the substrate (W) held on the holding member (12) is rotated; a processing liquid supply unit (20) that supplies processing liquid (Lp) to the side of the rotating substrate (W) opposite to the facing surface (11a); and a heating unit (50) that irradiates heating light from above the side of the substrate (W) to which the processing liquid (Lp) is supplied, wherein the light absorption rate of the facing surface (11a) is at least 90% in the area where it does not overlap with the substrate (W) when viewed from above.
Need to check novelty before this filing date? Find Prior Art