Integrated substrate processing apparatus and method

TW202635090APending Publication Date: 2026-08-16PICOSUN OY
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Patent Information

Application Number
TW114138389
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-14
Filing Date
2025-10-03
Publication Date
2026-08-16

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Patent Text Reader

Abstract

This invention provides an integrated substrate processing apparatus (100) comprising a substrate module integrated under vacuum via a wafer processing module (150). The substrate module includes: a first substrate processing module (110) having a remote plasma generator (115) configured to process one substrate (101) at a time in a plasma-enhanced process; and a second substrate processing module (120) capable of processing a batch of substrates (101) in a thermal mode for thin film deposition. The substrate modules comprise a first substrate processing module (110) provided with a remote plasma generator (115), configured to process one substrate (101) at a time in a plasma-enhanced process, and a second substrate processing module (120) capable of processing a batch of substrates (101) in a thermal mode for thin film deposition.
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