Die transfer device, die level test system comprising the same, and control method of die transfer device

TW202635094APending Publication Date: 2026-08-16SEMICS INC
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Patent Information

Application Number
TW114152281
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-10-31
Filing Date
2025-12-31
Publication Date
2026-08-16

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Abstract

This invention discloses a die transfer device, a die level testing system, and a control method. The die transfer device includes: a first cavity having a receiving space and an inlet / outlet; a lower base disposed below the first cavity and laterally movable; a first chuck base disposed on the lower base for vertically supporting a thin film or a movable chuck; a second chuck base disposed on the lower base and vertically supporting a thin film transferred from the first chuck base; a transfer unit for transferring the thin film from the first chuck base to the second chuck base; and a pick-up device for picking up the die from the thin film on the second chuck base and placing it on the movable chuck on the first chuck base.
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