Die transfer device, die level test system comprising the same, and control method of die transfer device
TW202635094APending Publication Date: 2026-08-16SEMICS INC
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Patent Information
- Application Number
- TW114152281
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-10-31
- Filing Date
- 2025-12-31
- Publication Date
- 2026-08-16
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Abstract
This invention discloses a die transfer device, a die level testing system, and a control method. The die transfer device includes: a first cavity having a receiving space and an inlet / outlet; a lower base disposed below the first cavity and laterally movable; a first chuck base disposed on the lower base for vertically supporting a thin film or a movable chuck; a second chuck base disposed on the lower base and vertically supporting a thin film transferred from the first chuck base; a transfer unit for transferring the thin film from the first chuck base to the second chuck base; and a pick-up device for picking up the die from the thin film on the second chuck base and placing it on the movable chuck on the first chuck base.
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