Wafer cooling devices, front-end modules, process equipment, and wafer transfer methods

Abstract

This application discloses a wafer cooling device, a front-end module, semiconductor process equipment, and a wafer transfer method, belonging to the field of semiconductor processing technology. The disclosed wafer cooling device includes at least one support member, which includes a main body and a supporting portion connected to the main body. The supporting portion supports the wafer. The main body surrounds at least a portion of the supporting portion. The main body has a first water inlet, a first water outlet, and a first cooling channel surrounding the supporting portion. The first water inlet and the first water outlet are connected through the first cooling channel. This solution addresses the problem of slow cooling speed in related wafer cooling methods.

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