Wafer carrying device and semiconductor processing equipment

Abstract

The embodiments of the present application provide a wafer carrying device and a semiconductor processing equipment, wherein the wafer carrying device includes a first connecting member and at least three supporting members. The at least three supporting members are distributed circumferentially and are all connected to the first connecting member. Each supporting member includes a first protruding portion, and the first protruding portion protrudes toward the central axis around which the supporting members are arranged. A wafer passage region is formed between the upper surface of the first protruding portion and the lower surface of the first connecting member, and the first protruding portion is used for supporting the wafer.

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