Wafer processing equipment
TW202635111APending Publication Date: 2026-08-16HITACHI HIGH TECH CORP
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Patent Information
- Application Number
- TW115117084
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2022-09-26
- Filing Date
- 2023-09-07
- Publication Date
- 2026-08-16
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Abstract
To provide a semiconductor device manufacturing system and a semiconductor device manufacturing method that improves processing yield, the system comprises: a semiconductor device manufacturing apparatus for processing wafers, comprising: a wafer platform on which the wafer is mounted; and a plurality of heaters disposed inside the wafer platform and below a plurality of regions thereon; a controller for adjusting the output of a plurality of heater power supplies supplied to the plurality of heaters; and a wafer temperature calculation system for determining whether a first output value of the plurality of heater power supplies, pre-calculated to achieve a target temperature in the wafer processing, is within an allowable range, and if it is outside the allowable range, calculating a second output value that corrects all of the first output values to values within the allowable range.
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