Wafer processing equipment

TW202635111APending Publication Date: 2026-08-16HITACHI HIGH TECH CORP
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Patent Information

Application Number
TW115117084
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-09-26
Filing Date
2023-09-07
Publication Date
2026-08-16

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Abstract

To provide a semiconductor device manufacturing system and a semiconductor device manufacturing method that improves processing yield, the system comprises: a semiconductor device manufacturing apparatus for processing wafers, comprising: a wafer platform on which the wafer is mounted; and a plurality of heaters disposed inside the wafer platform and below a plurality of regions thereon; a controller for adjusting the output of a plurality of heater power supplies supplied to the plurality of heaters; and a wafer temperature calculation system for determining whether a first output value of the plurality of heater power supplies, pre-calculated to achieve a target temperature in the wafer processing, is within an allowable range, and if it is outside the allowable range, calculating a second output value that corrects all of the first output values ​​to values ​​within the allowable range.
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