Step ramp grading yield enhancement for hybrid bonding
TW202635113APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114136332
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-09-30
- Filing Date
- 2025-09-22
- Publication Date
- 2026-08-16
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Abstract
Step ramp grading yield enhancement for hybrid bonding is provided. A device may provide a plurality of first contacts on a first substrate. A device may provide a plurality of second contacts on a second substrate, the plurality of second contacts configured to align with the plurality of first contacts. A device may anneal the first substrate and the second substrate to electrically couple the plurality of first contacts to the plurality of second contacts, wherein at least one of an annealing time or an annealing temperature is based on a recess depth of the plurality of first contacts from a surface of the first substrate.
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