Multi-axis stage apparatus, wafer bonding method, and wafer bonding apparatus using the same

Abstract

This disclosure relates to a multi-axis stage apparatus, a wafer bonding method using the multi-axis stage apparatus, and a wafer bonding apparatus that can significantly improve wafer bonding accuracy. The apparatus may include: a base portion; a first drive unit configured to move at least partially vertically relative to the base portion a first distance in a third axial direction; a second drive unit formed on the first drive unit and configured to move at least partially vertically in the third axial direction a second distance; and an alignment stage connected to the second drive unit and configured to align with a first wafer chuck holding a first wafer, such that the first wafer can be vertically moved in the third axial direction by a distance equal to the sum of the first and second distances.

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