Substrate processing apparatus

Abstract

The substrate processing apparatus of the present invention includes three processing housings stacked in the vertical direction. Each of the three processing housings has a rotating chuck, a discharge section, a protective cover, a protective cover drainage path, a housing drainage path, and a connecting path within its internal space. The protective cover receives coating liquid splashed from the substrate held by the rotating chuck. The protective cover drainage path extends vertically downward from the protective cover to discharge the coating liquid received by the protective cover. The housing drainage path extends vertically. The connecting path connects the lower end of the protective cover drainage path to the housing drainage path. The housing drainage paths of each of the three processing housings are connected according to the vertical stacking arrangement of the three processing housings.

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