Offset alignment and repair in micro device transfer

TW202635128APending Publication Date: 2026-08-16VUEREAL INC
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Patent Information

Application Number
TW115100154
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-07-27
Filing Date
2021-03-30
Publication Date
2026-08-16

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Abstract

This invention relates to the process of correcting misalignment and filling voids after a microdevice transfer process. The process involves transfer heads, measurement of offset and misalignment in horizontal, vertical, and rotational errors. An execution of the new offset vector for the next transfer corrects the alignment.
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