Bonding device, bonding system, bonding method, computer program and readable computer storage medium

TW202635129APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115117315
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2016-12-01
Filing Date
2017-11-27
Publication Date
2026-08-16

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Abstract

This invention aims to inspect the condition of bonding treatment between substrates and appropriately conduct the bonding treatment. A bonding device for bonding an upper wafer WU and a lower wafer WL comprises an upper chuck
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