Semiconductor device and methods for manufacturing and inspecting the same

Abstract

A semiconductor device and methods for manufacturing and inspecting the same are disclosed. The manufacturing method comprises providing at least one substrate and forming at least one microstructure thereon. The formation is achieved by utilizing a processing technique selected from the group consisting of laser processing, microwave processing, radio frequency (RF) processing, electrical discharge machining (EDM), wet chemical processing, mechanical processing, plasma source processing, particle beam processing, and build-up processing. The resulting microstructure is selected from a group consisting of a hole-shaped structure, a line structure, and an optical structure. The method effectively improves processing efficiency and precision, and through the integration of diverse processing techniques combined with innovative substrate pre-processing and sidewall repair solutions, it enhances process flexibility, production efficiency, and structural reliability.

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