Substrate processing device
TW202635134APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW115118192
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2021-04-26
- Filing Date
- 2022-04-26
- Publication Date
- 2026-08-16
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Abstract
The present invention is a substrate processing apparatus for processing substrates, comprising: a processing chamber forming a processing space for the substrate inside; a heating mechanism for adjusting the internal temperature of the processing chamber; and an internal component disposed inside the processing chamber; wherein the heating mechanism comprises: an induction heating element for heating at least the internal component by induction of a magnetic field; and a magnetic field generating unit for generating the induction magnetic field.
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