Substrate processing device

TW202635134APending Publication Date: 2026-08-16TOKYO ELECTRON LTD
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Patent Information

Application Number
TW115118192
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2021-04-26
Filing Date
2022-04-26
Publication Date
2026-08-16

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Abstract

The present invention is a substrate processing apparatus for processing substrates, comprising: a processing chamber forming a processing space for the substrate inside; a heating mechanism for adjusting the internal temperature of the processing chamber; and an internal component disposed inside the processing chamber; wherein the heating mechanism comprises: an induction heating element for heating at least the internal component by induction of a magnetic field; and a magnetic field generating unit for generating the induction magnetic field.
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