Packaging structures and methods of forming the same

Abstract

A device structure may be provided by: forming an array of through-dielectric via structures in a dielectric substrate; forming dielectric material layers and metal interconnect structures over the dielectric substrate; forming on-interposer bonding pads at a topmost level of the dielectric material layers; attaching at least one semiconductor die to the on-interposer bonding pads; and thinning a backside portion of the dielectric substrate such that bottom end surfaces of the through-dielectric via structures are exposed upon thinning of the backside portion of the dielectric substrate.

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