High bandwidth 3D mesh interconnect structure
TW202635139APending Publication Date: 2026-08-16ATUM WORKS INC
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Patent Information
- Application Number
- TW114150361
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-23
- Filing Date
- 2025-12-19
- Publication Date
- 2026-08-16
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Abstract
A device includes an interconnect structure comprising an at least partially annular conductive wire disposed about an insulator. The device includes a first contact pad at a first surface of an element, wherein the wire extends from the first contact pad in a direction non-parallel to the first surface and connects to a second contact pad.
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