Flip chip microdevice structure

Abstract

What is disclosed is various aspects of the structure of flip chip or lateral micro devices having protection of connections. The various aspects comprise a structural combination of functional layers such as doped or blocking layers or quantum well structure, as well as dielectric layers, VIA's, optical enhancements layers, connection pads, protective layers, masks and additional layers. In addition, methods of fabrication of microdevices have also been disclosed where in patterning has been used. The present disclosure further relates to integrating vertical microdevices into a system substrate. The system substrate can have a backplane circuit as well.The integration covers the microdevices with dielectrics and couples the backplane through a VIA.

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