Package substrate and fabricating method thereof

Abstract

A packaging substrate is made by forming a dielectric layer on a core layer with a wiring layer, and forming a cavity exposing the wiring layer on the dielectric layer, and then forming a first conductive layer, colloid and a second conductive layer, in sequence, in the cavity. Therefore, the colloid is disposed in the cavity to effectively avoid problems such as void, seam, crack and delamination and other undesirable conditions if the large area of the cavity is completely filled with electroplated copper material.

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