Wafers and their manufacturing methods

TW202635150APending Publication Date: 2026-08-16XIAN ESWIN MATERIAL TECHNOLOGY CO LTD
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Patent Information

Application Number
TW114150926
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-17
Filing Date
2025-12-24
Publication Date
2026-08-16

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Abstract

This disclosure provides a wafer and a method for manufacturing the same. The wafer may include a body and a reinforcing portion, the reinforcing portion being filled into the wafer from the back side; wherein the elastic modulus of the material of the reinforcing portion is greater than the elastic modulus of the material of the body.
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