Electronic devices and methods of manufacturing electronic devices

Abstract

In one example, an electronic device includes a module comprising electronic components and a first encapsulant disposed around lateral sides of the electronic components. A substrate is coupled to the module. A metallic structure is coupled to a side of the module opposite the substrate, and the metallic structure is coupled to back sides of the electronic components. A thermal interface material is coupled to the metallic structure. A lid is coupled to the thermal interface material. Other examples and related methods are also disclosed herein.

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