Device and system for immersion cooling of semiconductor package

Abstract

Disclosed herein are device and system for immersion cooling of semiconductor package, including a supporting board and a first cooling structure on the supporting board, the first cooling structure including a first high-power density package immersed within a first dielectric fluid, the first dielectric fluid thermally coupled to the first high-power density package. A first connector is arranged between the first cooling structure and the supporting board and communicatively couples the first high-power density package to the supporting board. The first dielectric fluid is separated from the first connector by at least one surface of the first cooling structure. The first dielectric fluid has a first liquid phase and a first vapor phase within the first cooling structure.

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