Packaging structure and methods of forming the same

TW202635155APending Publication Date: 2026-08-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114111119
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-03
Filing Date
2025-03-25
Publication Date
2026-08-16

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Abstract

A packaging structure may be formed by: attaching a lid structure to a bonded assembly including at least one semiconductor die and a packaging substrate, and wherein the lid structure includes at least one threaded hole vertically extending from a top surface of the lid structure toward the bonded assembly; providing a heat sink including at least one through-hole; and passing at least one threaded fastener through a respective one of the at least one through-hole and engaging each of the at least one threaded fastener into a respective one of the at least one threaded hole, whereby the heat sink is affixed to the lid structure.
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