Circuit board with electromagnetic wave shielding film, its manufacturing method and electromagnetic wave shielding film

Abstract

This invention relates to a circuit board with an electromagnetic wave shielding film, comprising a substrate, a printed circuit formed on a surface of the substrate, and an insulating layer covering the printed circuit, and an electromagnetic wave shielding film; wherein the printed circuit includes a grounding circuit, and the electromagnetic wave shielding film comprises a metal-plated nonwoven fabric, an insulating film, and an adhesive for bonding the metal-plated nonwoven fabric and the insulating film; the metal-plated nonwoven fabric is inserted into a through hole from the surface of the insulating layer to the surface of the grounding circuit, and at least a portion of the metal-plated nonwoven fabric inserted into the through hole is electrically connected to the grounding circuit, thus constituting a circuit board with an electromagnetic wave shielding film.

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