Electronic device

Abstract

An electronic device is provided and includes a substrate, a plurality of electronic units, a conductive line, a bonding pad, an inspecting pad, and a cover. The substrate includes an active region and a peripheral region. The electronic units are disposed in the active region. The conductive line is disposed on the substrate and electrically connected to at least one of the electronic units. The bonding pad is disposed in the peripheral region and electrically connected to the conductive line. The inspecting pad is disposed in the peripheral region and electrically connected to the conductive line. The cover is opposite to the substrate, and the cover and the substrate are bonded to each other to form a cavity. The electronic units and the inspecting pad are located in the cavity, and the bonding pad is located outside the cavity.

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