Method for forming through vias in a die stack
TW202635167APending Publication Date: 2026-08-16APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114139718
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-30
- Filing Date
- 2025-10-15
- Publication Date
- 2026-08-16
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Figure TWG2TA001072755_001 
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Abstract
A method includes forming a plurality of dies on one or more first substrates. The method further includes stacking multiple dies of the plurality of dies on a second substrate to form a die stack. The method further includes forming a through-via in the die stack. The through-via electrically couples each of the multiple dies of the die stack.
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