Semiconductor package

TW202635183APending Publication Date: 2026-08-16INNOLUX CORP
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Patent Information

Application Number
TW114104774
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-02-10
Publication Date
2026-08-16

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Abstract

A semiconductor package is provided. The semiconductor package includes a first die, a first interconnection layer and an encapsulation layer. The first die includes a first portion and a second portion. The first portion has a first surface and the second portion has a second surface. The first interconnection layer is disposed on the second surface. The encapsulation layer surrounds the first die and the first interconnection layer. In a cross-sectional view, the first portion has a first width at the first surface. The second portion has a second width at an interface between the first portion and the second portion. The second width is greater than the first width.
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