Package structure and methods of manufacturing the same

Abstract

A packaging structure may be formed by: providing a composite package including at least one semiconductor die and a die frame; attaching the composite package to a packaging substrate to form a bonded assembly; providing a lid structure including a bottom plate portion, a top plate portion, a sidewall frame portion laterally surrounding a cavity located between the bottom plate portion and the top plate portion, and solid block portions vertically extending between the bottom plate portion and the top plate portion; and attaching the lid structure to the bonded assembly such that a thermal interface material （TIM） layer is interposed between the at least one semiconductor die and the bottom plate portion. The solid block portions do not have any areal overlap with the at least one semiconductor die in a plan view along a vertical direction.

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