Semiconductor package having dual transistors and method of making the same
TW202635189APending Publication Date: 2026-08-16ALPHA & OMEGA SEMICON INT LP
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Patent Information
- Application Number
- TW115102209
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-04
- Filing Date
- 2026-01-20
- Publication Date
- 2026-08-16
Smart Images
Figure TWG2TA001073391_001 
Figure TWG2TA001073391_002 
Figure TWG2TA001073391_003
Abstract
A semiconductor package comprises a lead frame, a first field-effect transistor (FET), a second FET, a metal clip, and a molding encapsulation. Each of the first FET and the second FET is flipped. A method comprising the steps of providing a lead frame strip; mounting a first FET and a second FET; attaching a metal clip strip; forming a molding encapsulation, and applying a singulation process.
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