Die bonding device and die bonding position control method

TW202635192APending Publication Date: 2026-08-16SYSTEM ENGINEERING MEGA SOLUTION CO LTD
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Patent Information

Application Number
TW114141099
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-31
Filing Date
2025-10-23
Publication Date
2026-08-16

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Abstract

The invention relates to a die bonding device and a die bonding position control method. A technology is provided to improve bonding accuracy by real-time identifying the die position and the bonding position on the substrate and controlling the position of the bonding head so that the two positions are accurately aligned.
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