Semiconductor packages with plasma-etched scallops

Abstract

In examples, a semiconductor package includes a substrate including a first opening; a first semiconductor die coupled to the substrate and including a microelectromechanical systems (MEMS) membrane, the first semiconductor die including a scalloped outer surface having multiple concavities; a second semiconductor die coupled to the substrate and configured to control the first semiconductor die; bond wires coupling the first and second semiconductor dies to the substrate; and a protective enclosure covering the substrate, the first and second semiconductor dies, and the bond wires.

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